Events​​​​​​​

At this German-speaking event, potentials and perspectives of future-oriented manufacturing processes in the field of injection molding technology will be shown.

In the exhibitor area next door, FEMFAT will also be represented with its own booth.

Get in touch with one of our sales colleagues and listen to the presentation of Klaus Hofwimmer on 
​​​​​​​"Lifetime Calculation and Material Generation of Short Fiber Reinforced Plastics: Methods and Applications".

The annual SIMULIA Regional User Meeting (RUM) is a user-focused event, where practicing engineers and researchers can meet & network, share ideas and meet with SIMULIA experts.

You are interested in exchanging ideas and experiences in all aspects of simulation technology?

Join the event and stop by at our booth to learn more about our software product FEMFAT and listen to the speech of our colleague on "Simulative evaluation of bearing seat wear".

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Join our Conference​​​​​​​

As disciplines in engineering are connected closer than ever and applications require software tools that can combine the strengths of different fields, we gladly invite you to this conference bundling thermal and structural topics.

We hope that you will find touch points not only within the large fields but even in between. Feel free to join the workshops and lectures at your pleasure.

This world conference is the largest and most comprehensive hardware and software exhibition on the subject of simulation. New technologies and innovative techniques will be presented.

Stop by at our FEMFAT booth to learn more about our simulation services & software and listen to the speech of our colleague W. Hinterberger on "Structural assessment of printed circuit board assemblies under consideration of static-, vibrational- and thermal loads based on finite element methods".

We look forward to welcoming you at "NAFEMS World Congress 2025".

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Organized by JSAE, EVTeC is a conference that focuses on technologies for future mobility by xEV such as BEVs, HEVs, FCEVs, PHEVs and various other related technologies. 

Join the event and listen to the speech of our colleague Walter Hinterberger on "Structural assessment of printed circuit board assemblies under consideration of static-, vibrational- and thermal loads based on finite element methods".

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