Events​​​​​​​

Aachen ist one of the most important centers in development and research in automotive acoustics. Innovative methods and technologies in the fields of acoustics and vibrations of vehicles and drives building the center of the 15th AAC and its program.

Listen to the speech of our colleague Anton Plank about  "Simulative Evaluation of eMotor Acoustic Performance Across Varied Load Spectra and Correlation Study to Measurements".

We look forward to welcoming you at Aachen Acoustics Colloquium 2024!​​​​​​​

Numerical simulations are an established part of modern product development. Fatigue strength is developing into a cross-material, model-based design discipline for complex components and component systems, bridging the gap between experimental and numerical simulations.

Listen to the speech of our colleague M. Frank on the topic of "Fatigue Analysis of Structural Adhesive Joints". 

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Join our Conference​​​​​​​

As disciplines in engineering are connected closer than ever and applications require software tools that can combine the strengths of different fields, we gladly invite you to this conference bundling thermal and structural topics.

We hope that you will find touch points not only within the large fields but even in between. Feel free to join the workshops and lectures at your pleasure.

This world conference is the largest and most comprehensive hardware and software exhibition on the subject of simulation. New technologies and innovative techniques will be presented.

Stop by at our FEMFAT booth to learn more about our simulation services & software and listen to the speech of our colleague W. Hinterberger on "Structural assessment of printed circuit board assemblies under consideration of static-, vibrational- and thermal loads based on finite element methods".

We look forward to welcoming you at "NAFEMS World Congress 2025".

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Organized by JSAE, EVTeC is a conference that focuses on technologies for future mobility by xEV such as BEVs, HEVs, FCEVs, PHEVs and various other related technologies. 

Join the event and listen to the speech of our colleague Walter Hinterberger on "Structural assessment of printed circuit board assemblies under consideration of static-, vibrational- and thermal loads based on finite element methods".

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